Semiconductor Industry Solutions

Micro-Nano Level Quality Control

Challenge

Semiconductor key components require ultra-tight micro- and nano-scale tolerances, including wafer transfer positioning, ceramic suction cup flatness, spray head micro-holes, sputtering target flatness, and silicon carbide part precision. Measuring these is highly challenging due to complex structures and hard materials. Spray heads have thousands of deep micro-holes prone to tool wear, while SiC hardness and material uniformity add difficulty. The manufacturing process spans many stages with scattered data and no unified quality traceability or real-time feedback, limiting optimization and yield.

Solution

AEH offers a combined high-precision CMM and automated optical measurement system with non-contact sensors and specialized fixtures to tackle SiC parts and spray head micro-holes. The NET-DMIS software, integrated with EMRP’s intelligent quality platform, supports complex geometry analysis and real-time SPC monitoring. AEH provides tailored semiconductor solutions, including custom measurement programs and fast technical support to meet industry demands.

Result/Outcome

High-Efficiency Precision Measurement Dedicated measurement strategies for dense features like showerhead micro-holes—maintaining micron-level accuracy while increasing inspection efficiency by 40%. Specialized for Complex Materials Optimized sensor configuration and measurement algorithms effectively address challenges of high-hardness materials (silicon carbide) and wafer warpage. Process-Adapted Solutions Customized measurement solutions for specialized semiconductor processes, including accuracy compensation for different vacuum environments. Intelligent Data Fusion Seamless multi-sensor data integration via unified software platform, establishing a complete measurement-analysis-process feedback closed loop.

40%

Inspection efficiency up by

±1μm

Wafer transfer module positioning accuracy reaches

25%

First-pass yield up by

Industry Pain Points

Extremely High Micro-Nano Tolerance Requirements for Key Components:
Key components such as wafer transfer module positioning accuracy, ceramic chuck flatness, spray nozzle micro-hole machining quality (position tolerance typically 0.05mm, aperture tolerance ±0.02mm), sputtering target flatness, and geometric accuracy of silicon carbide structural parts require strict micro-nano level geometric tolerances, posing significant measurement challenges.

High Difficulty in Measuring Special Materials and Complex Structures:
The machining precision of tens of thousands of micro-holes in spray nozzles directly affects film uniformity. Deep micro-hole machining (aspect ratio up to 51:1) faces chip removal difficulties and frequent tool breakage. The high hardness of silicon carbide parts, uniform distribution of ceramic chuck micro-holes, and microscopic uniformity of sputtering target materials further increase measurement complexity.

Lack of Full-Process Quality Traceability and Data Closed-Loop:
Semiconductor manufacturing involves multiple stages including front-end processes (such as lithography, etching, thin films) and back-end packaging and testing. Measurement data is scattered across these stages. Currently, there is no comprehensive inspection solution covering the entire process, making unified data management and real-time feedback control difficult, limiting process optimization and yield improvement.

Customer Requirements

Micron-Level Precision with Efficient Inspection:
Achieving stable, fast measurements at micron-level precision while improving inspection efficiency to meet the dual demands of accuracy and throughput in semiconductor manufacturing, especially for advanced process equipment and back-end packaging testing.

Accurate Analysis of Complex Geometric Features:
Capable of precisely analyzing complex geometric features such as spray nozzle micro-holes, ceramic chuck flatness, and silicon carbide structural contours, while addressing unique measurement challenges posed by deep micro-hole machining (e.g., blind holes with aspect ratio 51:1) and high-hardness materials.

Full-Process Quality Data Control Covering Front-End and Back-End:
Providing solutions that cover the entire process from front-end wafer manufacturing to back-end packaging testing, establishing a real-time feedback control system for measurement data, forming a complete quality data chain to support process optimization and yield improvement.

Limitations of Existing Measurement Solutions

Difficulty Balancing Measurement Efficiency and Precision:
In complex scenarios such as tens of thousands of spray nozzle micro-holes and high-precision positioning of wafer transfer modules, it is often challenging to balance measurement speed and accuracy, resulting in incomplete detail capture or low inspection efficiency.

Poor Adaptability to Complex Structures and Special Materials:
General measurement equipment lacks sufficient adaptability for special materials and complex structures such as high-hardness silicon carbide, deep micro-hole structures in spray nozzles (aspect ratio 51:1), and ceramic chuck micro-hole distribution, making it difficult to ensure measurement accuracy and stability.

Weak System Integration and Data Closed-Loop Capability:
Different measurement devices usually operate independently with inconsistent data standards, lacking effective multi-source information fusion mechanisms. This prevents the construction of a comprehensive "measurement-analysis-process feedback" closed loop covering both front-end and back-end processes, limiting the depth and efficiency of full-process quality control in semiconductor manufacturing.

AEH Solution

Measurement Systems:
Offering a combined solution of high-precision coordinate measuring machines (CMM) and automated optical measurement instruments. Featuring non-contact measurement, dual Z-axis design, equipped with composite measurement sensors and dedicated fixtures, precisely addressing measurement challenges of special components such as silicon carbide structural parts and spray nozzle micro-holes.

Core Software:
Integrated with NET-DMIS measurement software and the EMRP intelligent quality management platform, supporting complex geometric feature analysis and establishing real-time SPC (Statistical Process Control) monitoring systems for enhanced process control.

Professional Services:
Providing semiconductor industry-specific solutions, including customized measurement program development and rapid-response technical support services to ensure optimal system performance and minimize downtime.